Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-06-20
2006-06-20
Tran, Mai-Huong (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S698000, C428S200000
Reexamination Certificate
active
07064419
ABSTRACT:
A die attach region for use in an IC package is described. The die attach region employs a number of posts interconnected with a number of support risers to provide a structure that upholds a semiconductor die while facilitating flow of an encapsulant material underneath the die during encapsulation. The posts and risers can be arranged in a number of configurations that each facilitate flow of encapsulant material. This die attach region can be incorporated into a lead-frame structure or a substrate panel for ease and efficiency of manufacture.
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Bayan Jaime A.
Kong Lye Meng
Ling Chan Chee
Nadarajah Santhiran S O
Prabhu Ashok S.
Beyer Weaver & Thomas LLP
National Semiconductor Corporation
Tran Mai-Huong
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