Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate
2007-08-28
2007-08-28
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With separate tie bar element or plural tie bars
C257S622000, C257S666000, C257S676000, C257S787000, C257SE23001, C257SE23180, C257SE23190, C257SE23037, C257SE23067
Reexamination Certificate
active
11220761
ABSTRACT:
A semiconductor device package comprising a semiconductor device and an electrically conductive lead frame at least partially covered by a molding compound. The electrically conductive lead frame includes a plurality of leads disposed proximate a perimeter of the package and a die pad disposed in a central region formed by the plurality of leads. The die pad includes a first die pad surface disposed at the first package face, and a second die pad surface opposite the first die pad surface. The semiconductor device is attached to a central region of the second die pad surface, and a portion of the second die pad surface extending outward from the die is roughened to improve adhesion of the die pad to the molding compound. In other aspects, grooves are disposed in the first and/or second die pad surfaces to further promote adhesion of the die pad and to prevent moisture from permeating into the vicinity of the semiconductor chip. The die pad may further include tie bars extending therefrom, and at least one lip at may extend from a side surface of the die pad to anchor the die pad in the molding compound. The die pad may also include apertures disposed therein for allowing the egress of moisture from the package.
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Islam Shafidul
San Antonio Romarico Santos
Subagio Anang
Advanced Interconnect Technologies Limited
Clark Jasmine
Rosenblatt Gregory S.
Wiggin and Dana LLP
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