Die paddle clamping method for wire bond enhancement

Details Die paddle clamping method for wire bond enhancement Die paddle clamping method for wire bond enhancement

1998-02-23

2000-09-19

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 23495

Patent

active

061216747

ABSTRACT:
A leadframe configuration for a semiconductor device has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.

REFERENCES:
patent: 3708730 (1973-01-01), Schierz et al.
patent: 4214120 (1980-07-01), Jones, Jr. et al.
patent: 4766478 (1988-08-01), Dennis
patent: 5307929 (1994-05-01), Seilder
patent: 5420758 (1995-05-01), Liang

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