Die pad structure for solder bonding

Details Die pad structure for solder bonding Die pad structure for solder bonding

1996-01-24

1998-12-01

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257667, 257669, H01L 23495

Patent

active

058443061

ABSTRACT:
A lead frame having a die pad of such a shape that prevents scattering of solder to lead when a chip is mounted on the lead frame, and a semiconductor device using such a lead frame are provided. The lead frame includes a die pad having a region surrounded by a first side, a second side opposing to the first side, a third side different from the first and second sides, and a fourth side opposing to the third side, and a lead formed of a conductor and electrically connected to a semiconductor element. The die pad includes a notch extending along the first and the second sides and positioned opposing to a main surface of the semiconductor element, and a through hole extending along the third and fourth sides and positioned opposing to the main surface of the semiconductor element. The semiconductor device employs the die pad.

REFERENCES:
patent: 5397915 (1995-03-01), Noes
patent: 5440169 (1995-08-01), Tomita et al.

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