Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-01-29
2008-01-29
Purvis, Sue A. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S676000, C257S782000, C257S784000, C257SE23003, C257SE23006, C257SE23020, C257SE23037, C257SE23043
Reexamination Certificate
active
10965653
ABSTRACT:
An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surface and a lower surface, with the upper surface configured to electrically couple a first end of a first electrically conductive lead wire. A second end of the first electrically conductive lead wire is bonded to the integrated circuit die. The upper surface is further configured to electrically couple a first end of a second electrically conductive lead wire and a second end of the second electrically conductive lead wire is bonded to a lead finger of the electrical package.
REFERENCES:
patent: 4771330 (1988-09-01), Long
patent: 5157480 (1992-10-01), McShane et al.
patent: 5168368 (1992-12-01), Gow et al.
patent: 5196992 (1993-03-01), Sawaya
patent: 5399904 (1995-03-01), Kozono
patent: 5512781 (1996-04-01), Inoue
patent: 5804468 (1998-09-01), Tsuji et al.
patent: 6313519 (2001-11-01), Gainey et al.
patent: 6388311 (2002-05-01), Nakashima et al.
patent: 6577019 (2003-06-01), Roberts et al.
patent: 6603195 (2003-08-01), Caletka et al.
patent: 6818973 (2004-11-01), Foster
patent: 6908843 (2005-06-01), Baldonado et al.
patent: 2002/0149099 (2002-10-01), Shirasaka et al.
patent: 2003/0015780 (2003-01-01), Kang et al.
patent: 2003/0205795 (2003-11-01), Roberts et al.
Printout: Simtek Corporation, “Production Leadframes”, Sep. 2002, 6 pages.
Atmel Corporation
Purvis Sue A.
Rodela Eduardo A.
Schneck & Schneck
LandOfFree
Die attach paddle for mounting integrated circuit die does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Die attach paddle for mounting integrated circuit die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die attach paddle for mounting integrated circuit die will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3905713