LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device lead frame having sunk die pad portions

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Semiconductor device module frame and group thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device mounted on a grooved head frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device mounted on die pad having central slit patt

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Semiconductor device mounted on heat sink having protruded...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Semiconductor device mounting structure including lead frame and

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Semiconductor device of the LOC structure type having a flexible

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device of vertical surface-mounting type

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device package and method of assembly thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device package having a connection substrate with

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device package having twice-bent tie bar and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Semiconductor device package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device package with base features to reduce...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device package with plural pad lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device package with reduced leakage

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Semiconductor device packages having dummy block leads and tie b

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device packaging assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Semiconductor device tester and method of testing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device using bonding wires of different materials