Semiconductor device mounted on a grooved head frame

Details Semiconductor device mounted on a grooved head frame Semiconductor device mounted on a grooved head frame

1997-03-28

1998-10-06

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257667, 257669, 257674, H01L 23495

Patent

active

058181032

ABSTRACT:
A semiconductor device has a semiconductor chip mounted on the mounting portion of a lead frame and sealed with resin. The chip is affixed to the lead frame by melting. A groove is formed in the lead frame in a cruciform, radial, lattice or similar pattern capable of reducing thermal stress during intermittent performance test and cycling test while insuring heat radiation.

REFERENCES:
patent: 4797786 (1989-01-01), Manabe
patent: 4910577 (1990-03-01), Sonoda et al.
patent: 4918511 (1990-04-01), Brown
patent: 4942452 (1990-07-01), Kitano et al.
patent: 4952999 (1990-08-01), Robinson et al.
patent: 5150193 (1992-09-01), Yasuhara et al.
patent: 5661338 (1997-08-01), Yoo et al.

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