Semiconductor device lead frame having sunk die pad portions

Details Semiconductor device lead frame having sunk die pad portions Semiconductor device lead frame having sunk die pad portions

1992-09-15

1998-06-02

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257785, 257414, 257666, 257669, 73700, H01L 23495, H01L 2348, H01L 2714

Patent

active

057604673

ABSTRACT:
A lead frame includes a die pad having a plurality of die pads including a main die pad and an auxiliary die pad respectively supported by a main die pad supporting lead and an auxiliary die pad supporting lead extending inwardly from opposite sides of a planar annular frame, thereby inhibiting vertical movement of the die pad to which a load member is die-bonded. This support prevents deformation and breaking of wires bonded to the load member and the lead frame.

REFERENCES:
patent: 4287501 (1981-09-01), Tominaga et al.
patent: 4595945 (1986-06-01), Graver
patent: 4937656 (1990-06-01), Kohara
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5208481 (1993-05-01), Kurita et al.

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