Semiconductor device mounted on die pad having central slit patt

Details Semiconductor device mounted on die pad having central slit patt Semiconductor device mounted on die pad having central slit patt

1996-01-22

1998-01-27

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257676, H01L 23495

Patent

active

057125074

ABSTRACT:
A plurality of slits are formed in a die pad of a lead-frame for mounting a semiconductor chip, and are arranged in such a manner as to nearly equalize the length of peripheral sub-areas of the die pad uncovered with the semiconductor chip, thereby effectively absorbing a shrinkage and an elongation due to a difference in thermal expansion coefficient among the die pad, the semiconductor chip and a plastic package hermetically sealing the semiconductor chip.

REFERENCES:
patent: 4797726 (1989-01-01), Manabe
patent: 4918511 (1990-04-01), Brown

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