Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2011-04-12
2011-04-12
Soward, Ida M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C257S706000, C257S707000, C257S717000, C257S720000, C257S796000, C257SE23101, C257SE23103, C257SE23105
Reexamination Certificate
active
07923826
ABSTRACT:
A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.
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Shishido Mamoru
Takahashi Noriyuki
Mattingly & Malur, P.C.
Renesas Electronics Corporation
Soward Ida M
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