LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Semiconductor device having a tapeless mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Semiconductor device having a universal die size inner lead layo

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device having adhesive between lead and chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device having all outer leads extending from one s

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor device having an improved lead arrangement and met

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Semiconductor device having an improved structure for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Semiconductor device having an insulating layer and method for m

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device having an universal die size inner lead lay

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Semiconductor device having bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Semiconductor device having circuit pattern along outer peripher

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Semiconductor device having conducting portion of upper and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Semiconductor device having conducting portion of upper and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Semiconductor device having curved leads offset from the...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Semiconductor device having first chip secured within resin...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device having grooved leads to confine solder...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device having grooves to relieve stress...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Semiconductor device having improved heat resistance

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Semiconductor device having improved leads comprising palladium

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor device having increased moisture path and...