Semiconductor device having curved leads offset from the...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Reexamination Certificate

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Details

C257S674000, C257S692000, C257S773000, C361S773000, C361S813000

Reexamination Certificate

active

10960099

ABSTRACT:
A semiconductor device including: a substrate on which a plurality of leads are formed; and a semiconductor chip mounted on the substrate in such a manner that a surface of the semiconductor chip having a plurality of electrodes faces the substrate. Each of the leads includes a first portion that is bonded to one of the electrodes and a second portion that extends outward from the inner side of a region in the substrate that overlays the semiconductor chip. The second portion is entirely adhered to the substrate and curved.

REFERENCES:
patent: 5825081 (1998-10-01), Hosomi et al.
patent: 6342727 (2002-01-01), Fujimori
patent: 6559524 (2003-05-01), Seko
patent: 6605523 (2003-08-01), Takano
patent: 6737752 (2004-05-01), Hilton
patent: 2004/0178501 (2004-09-01), Son et al.
patent: A-04-287937 (1992-10-01), None
patent: A-07-029936 (1995-01-01), None
patent: A-11-186332 (1999-07-01), None
patent: A-2001-326243 (2001-11-01), None
patent: A-2002-184812 (2002-06-01), None
patent: A-2004-193223 (2004-07-01), None
patent: A-2004-274007 (2004-09-01), None

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