Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2005-01-11
2005-01-11
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S698000, C257S696000, C257S691000, C257S673000, C257S690000, C257S784000, C257S751000, C257S734000, C257S737000, C257S738000, C257S774000, C257S773000
Reexamination Certificate
active
06841853
ABSTRACT:
A semiconductor device including a semiconductor chip having an electric circuit on a surface thereof, and an electrode pad formed on the surface of the semiconductor chip and which is electrically connected to the electric circuit. A conductive pattern is electrically connected to the pad, and a sealing resin covers the electric circuit and the conductive pattern. A part of the conductive pattern is exposed from the sealing resin, and a plurality of grooves are formed on the part of the conductive pattern. The plurality of grooves are disposed apart from each other and along a direction of stress of the expanding semiconductor chip. An external electrode is electrically connected to the conductive pattern. Stress of the external electrodes is thus relieved and as a result, reliability of the semiconductor device can be improved, because deterioration of the connecting quality can be prevented.
REFERENCES:
patent: 6037786 (2000-03-01), Palagonia
patent: 6085968 (2000-07-01), Swindlehurst et al.
patent: 6400021 (2002-06-01), Cho
patent: 20020011677 (2002-01-01), Yokoi et al.
patent: 20020125043 (2002-09-01), Yoshida
patent: 20030089969 (2003-05-01), Hashimoto
patent: 20030092219 (2003-05-01), Ohuchi et al.
patent: 20030218246 (2003-11-01), Abe et al.
patent: 2000-340696 (2000-12-01), None
patent: 2001-144217 (2001-05-01), None
patent: 2001-196403 (2001-07-01), None
patent: 2001-332653 (2001-11-01), None
patent: 2002-93948 (2002-03-01), None
patent: 2002-280484 (2002-09-01), None
patent: 2002-280487 (2002-09-01), None
patent: WO 0077843 (2000-12-01), None
Oki Electronic Industry Co., Ltd.
Volentine Francos & Whitt PLLC
Williams Alexander Oscar
LandOfFree
Semiconductor device having grooves to relieve stress... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device having grooves to relieve stress..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having grooves to relieve stress... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3367075