Semiconductor device having an improved lead arrangement and met

Details Semiconductor device having an improved lead arrangement and met Semiconductor device having an improved lead arrangement and met

1989-07-19

1993-03-30

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257673, H01L 2160, H01L 2328

Patent

active

051988836

ABSTRACT:
First and second frame bodies are used to fabricate a semiconductor device. The first frame body includes a die pad. The second frame body only includes a plurality of leads. The die pad is depressed by a predetermined amount which is equal or greater than the thickness of a semiconductor chip to be mounted on the die pad. The two frame bodies are welded, and wire bonding and cutting of the leads are performed.

REFERENCES:
patent: 4298883 (1981-11-01), Komatsu et al.
patent: 4330790 (1982-05-01), Burns
patent: 4563811 (1986-01-01), Cranston
patent: 4788583 (1988-11-01), Kawahara
patent: 4791473 (1988-12-01), Phy
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4907129 (1990-03-01), Shimizu
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5072280 (1991-12-01), Matsukura

Affiliated with

Also associated with

Rating

Semiconductor device having an improved lead arrangement and met does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having an improved lead arrangement and met, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having an improved lead arrangement and met will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1284915