Semiconductor device having adhesive between lead and chip

Details Semiconductor device having adhesive between lead and chip Semiconductor device having adhesive between lead and chip

1998-01-12

2000-08-01

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, H01L 23495

Patent

active

060970812

ABSTRACT:
Disclosed is a packaged semiconductor device, e.g., of the lead-on-chip type, having reduced thickness, by providing only an adhesive (without a base film) between inner lead portions of the leads and the semiconductor chip to adhere the inner-lead portions to the chip. The adhesive can cover a dicing area of the semiconductor chip, and, in general, can cover edge parts of the chip (and extend beyond the edge of the chip) to prevent short-circuits between the inner lead portions and the semiconductor chip. The outer lead portions have a lower outer end part and a part, closer to the package body, which extends upward obliquely; has stopper members on the obliquely extending part; and has an obliquely extending part with a greater width than a width of the outer end parts of the outer lead portions, to facilitate stacking of packaged semiconductor chips on each other, e.g., for mounting on a printed circuit board. Packaged semiconductor chips having, e.g., outer lead portions with a part that extends upward obliquely, can be mounted on opposed sides of a printed circuit board while facing in the same direction, thereby simplifying wiring of the device.

REFERENCES:
patent: 4943843 (1990-07-01), Okinaga et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5872398 (1999-02-01), King et al.

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