Semiconductor device having a tab tape and a ground layer

Details Semiconductor device having a tab tape and a ground layer Semiconductor device having a tab tape and a ground layer

1997-08-29

2000-04-04

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257778, 257780, H01L 23495

Patent

active

06046495&

ABSTRACT:
A TAB tape is provided which has a ground layer which is connected to a ground wire within a device hole in a base film. A resin sealing hole for the purpose of holding in place a semiconductor chip and the base film is provided in the center of the ground layer, and a package in which a ground wire 8 is connected to a ground pad electrode is sealed with resin. Then, after forming bumps for heat radiating and grounding in the openings in the covering resist over the ground layer, the package is cut away, and is laid onto and joined to a printed circuit board, thereby forming shortened ground wiring within the semiconductor chip, not only reducing the inductance thereof, but also improving its radiation of heat.

REFERENCES:
patent: 5376588 (1994-12-01), Pendse
patent: 5397921 (1995-03-01), Karnezos
patent: 5640047 (1997-06-01), Nakashima

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