Semiconductor device having improved heat resistance

Details Semiconductor device having improved heat resistance Semiconductor device having improved heat resistance

1997-06-20

1998-06-02

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

257668, 257687, 257705, 257753, 257698, 257650, 257633, 257693, 257787, 438123, H01L 2300, H01L 2328, H01L 2302, H05K 502

Patent

active

057604665

ABSTRACT:
A semiconductor device including an insulating substrate which has a semiconductor element-mounting portion for mounting a semiconductor element on the center of its top surface, and a plurality of metallized wiring layers which lead outward extendedly from the periphery of the semiconductor element-mounting portion to the rim of the top surface; a semiconductor element which is mounted on the semiconductor element-mounting portion and has electrodes connected to the inner end sections of the metallized wiring layers; a plurality of outer lead terminals which are attached to the outer end sections of the metallized wiring layers to connect the semiconductor element to an exterior electric circuit; and a molding resin which covers the insulating substrate, the semiconductor element and part of the outer lead terminals.

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patent: 4691225 (1987-09-01), Murakami et al.
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patent: 5070393 (1991-12-01), Nakagawa et al.
patent: 5087964 (1992-02-01), Hatta
patent: 5302852 (1994-04-01), Kaneda et al.
patent: 5365409 (1994-11-01), Kwon et al.
patent: 5402318 (1995-03-01), Otsuka et al.
patent: 5559316 (1996-09-01), Iomoda

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