Semiconductor device having bumps

Details Semiconductor device having bumps Semiconductor device having bumps

2005-04-12

2005-04-12

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S666000, C257S737000, C257S738000

Reexamination Certificate

active

06879027

ABSTRACT:
In a semiconductor device, each of the leads is provided with guided-surfaces that are inclined surfaces and each of the bumps is provided with a recess that has guide-surfaces formed by inclined surfaces. The leads are smoothly guided toward the centers of the upper surfaces of the bumps with the aides of the inclined surfaces formed on the leads and bumps, so that the attitude of the leads is corrected and the leads are snugly brought into the recess and prevented form falling off of the bump.

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