Semiconductor device having all outer leads extending from one s

Details Semiconductor device having all outer leads extending from one s Semiconductor device having all outer leads extending from one s

1998-10-07

2000-08-08

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257691, H01L 23495

Patent

active

061005800

ABSTRACT:
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

REFERENCES:
patent: 3783348 (1974-01-01), Swartz et al.
patent: 4203792 (1980-05-01), Thompson
patent: 4209355 (1980-06-01), Burns
patent: 4355463 (1982-10-01), Burns
patent: 4577214 (1986-03-01), Schaper
patent: 4595945 (1986-06-01), Graver
patent: 4637130 (1987-01-01), Fujii et al.
patent: 4661837 (1987-04-01), Sono
patent: 4684975 (1987-08-01), Takiar et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4809053 (1989-02-01), Kuralshi
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4903113 (1990-02-01), Frankeny et al.
patent: 4916519 (1990-04-01), Ward
patent: 4951122 (1990-08-01), Tsubosaki et al.
patent: 4965654 (1990-10-01), Karner et al.
patent: 4996587 (1991-02-01), Hinrischsmeyer et al.
patent: 5049981 (1991-09-01), Dehringer
patent: 5072780 (1991-12-01), Matsukwia
patent: 5089876 (1992-02-01), Ishioka et al.
patent: 5105261 (1992-04-01), Ueda et al.
patent: 5115298 (1992-05-01), Loh
patent: 5198883 (1993-03-01), Takahashi et al.
patent: 5357139 (1994-10-01), Yaguchi et al.
patent: 5530286 (1996-06-01), Murakami et al.
patent: 5612569 (1997-03-01), Murakami et al.
patent: 5656551 (1997-08-01), Corbett et al.

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