Lead frame which includes a die pad, a support lead, and...
Lead frame wire bonding clamp member
Lead frame with deformable buffer portions
Lead frame with each lead having a peel generation preventing me
Lead frame with flag support structure
Lead frame with heat slug
Lead frame with improved adhesiveness property against plastic a
Lead frame with included passive devices
Lead frame with increased strength and manufacture of semiconduc
Lead frame with leads projecting alternately from opposite sides
Lead frame with multiple rows of external terminals
Lead frame with notched lead ends
Lead frame with plated end leads
Lead frame with pre-mold paddle for a semiconductor chip package
Lead frame with raised leads and plastic packaged...
Lead frame with selected inner leads coupled to an inner frame m
Lead frame with strip-shaped die bonding pad
Lead frame without power buses for lead on chip package, and a s
Lead frame, and method for manufacturing semiconductor...
Lead frame, circuit board with lead frame, and method for...