Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1998-05-07
1999-10-19
Fahmy, Wael M.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257667, 257668, 257669, 257676, H01L 2348, H01L 2156
Patent
active
059694114
ABSTRACT:
A lead frame is prepared which has a plurality of leads whose inner lead portions are coupled to a support member and a notch formed across the bottom surface of each inner lead portion near at its front portion on the support member side. After an LSI chip is adhered to the support member, pads on the chip are connected via bonding wires to corresponding inner leads of the plurality of leads. The chip and inner lead portions are buried in an insulating layer made of resin or the like as protective coating. Each inner lead portion is cut with a cutting device such as laser beam at the notch position to separate the inner lead portion from the support member. Thereafter, the separated assembly unit is accommodated in a package made of resin or the like, and the outer leads are cut and shaped. For an assembly method of a semiconductor device including a wire bonding process, bonding defects to be caused by deformed leads can be reduced.
REFERENCES:
patent: 4868635 (1989-09-01), Frechette et al.
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5696029 (1997-12-01), Alvarez et al.
Duong Hung Van
Fahmy Wael M.
Yamaha Corporation
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