Lead frame with selected inner leads coupled to an inner frame m

Details Lead frame with selected inner leads coupled to an inner frame m Lead frame with selected inner leads coupled to an inner frame m

1993-06-03

1995-01-10

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257678, 257691, 257778, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053810376

ABSTRACT:
A high performance hermetic integrated circuit package assembly for housing an integrated circuit die wherein the package assembly affords substantially reduced ground bounce within the integrated circuit. The package assembly includes a lead frame of electrically conductive material having a first predetermined pattern of outer leads and a second predetermined pattern of, integrally connected, inner leads for providing interconnection to the die through a plurality of contact pads thereon, a series of electrically conductive wires connecting selected ones of the contact pads to selected ones of the inner leads, a base for mounting the die and includes a first layer of glass for supporting the lead frame and, a cap with a second layer of glass for reacting with the first layer of glass to provide a hermetic enclosure for the die. The lead frame further includes a frame interconnection member at the ends of the outer leads for interconnecting all the outer leads and an inner frame member which includes an annular rectangle of electrically conductive material for interconnecting all inner ground leads for reducing the electrical inductances and resistances of the ground leads and for providing mechanical strength to the lead frame. A carrier ring disposed around the outer leads for providing mechanical stability and testability, and a plurality of spaced tie bar members extending integrally between the inner frame member and the frame interconnection member to allow for multi-stage trimming and forming of the outer leads from the carrier ring.

REFERENCES:
patent: 3748543 (1973-07-01), Roberson
patent: 4410905 (1983-10-01), Grabbe
patent: 4899207 (1990-02-01), Hallowell et al.
patent: 5229846 (1993-07-01), Kozuka
patent: 5235207 (1993-10-01), Ohi et al.

Affiliated with

Also associated with

Rating

Lead frame with selected inner leads coupled to an inner frame m does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame with selected inner leads coupled to an inner frame m, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame with selected inner leads coupled to an inner frame m will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-853066