Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2004-02-17
2009-02-10
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S676000, C257S684000, C257S693000, C257S698000, C257S723000, C257S924000, C438S106000, C438S123000, C438S051000, C438S054000, C438S108000
Reexamination Certificate
active
07489021
ABSTRACT:
An semiconductor device package (10) includes a semiconductor device (die) (12) and passive devices (14) electrically connected to a common lead frame (17). The lead frame (17) is formed from a stamped and/or etched metallic structure and includes a plurality of conductive leads (16) and a plurality of interposers (20). The passive devices (14) are electrically connected to the interposers (20), and I/O pads (22) on the die (12) are electrically connected to the leads (16). The die (12), passive devices (14), and lead frame (17) are encapsulated in a molding compound (28), which forms a package body (30). Bottom surfaces (38) of the leads (16) are exposed at a bottom face (34) of the package (10).
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European Patent Office, Supplemental European Search Report in Application No. EP 04 71 1876; Sep. 30, 2008.
Juskey Frank J.
Lau Daniel K.
Thompson Lawrence R.
Advanced Interconnect Technologies Limited
Clark Jasmine J
Wiggin and Dana LLP
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