Lead frame with included passive devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S676000, C257S684000, C257S693000, C257S698000, C257S723000, C257S924000, C438S106000, C438S123000, C438S051000, C438S054000, C438S108000

Reexamination Certificate

active

07489021

ABSTRACT:
An semiconductor device package (10) includes a semiconductor device (die) (12) and passive devices (14) electrically connected to a common lead frame (17). The lead frame (17) is formed from a stamped and/or etched metallic structure and includes a plurality of conductive leads (16) and a plurality of interposers (20). The passive devices (14) are electrically connected to the interposers (20), and I/O pads (22) on the die (12) are electrically connected to the leads (16). The die (12), passive devices (14), and lead frame (17) are encapsulated in a molding compound (28), which forms a package body (30). Bottom surfaces (38) of the leads (16) are exposed at a bottom face (34) of the package (10).

REFERENCES:
patent: 5229640 (1993-07-01), Pak
patent: 6424034 (2002-07-01), Ahn et al.
patent: 6713317 (2004-03-01), Knapp et al.
patent: 2002/0135049 (2002-09-01), Liu
patent: 2002/0145180 (2002-10-01), Terui et al.
patent: 2002/0195693 (2002-12-01), Liu et al.
patent: 2005/0056916 (2005-03-01), Sakamoto et al.
patent: 44 10 212 (1995-09-01), None
patent: 59-72757 (1984-04-01), None
patent: WO 96/30943 (1996-10-01), None
European Patent Office, Supplemental European Search Report in Application No. EP 04 71 1876; Sep. 30, 2008.

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