Lead frame wire bonding clamp member

Details Lead frame wire bonding clamp member Lead frame wire bonding clamp member

2005-03-01

2005-03-01

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S727000

Reexamination Certificate

active

06861733

ABSTRACT:
A clamp member or device includes a clamping portion with a rigid portion from which extend a number of independently flexible clamp fingers for contacting and clamping lead frame leads. The flexible clamp fingers have pivot points for pivoting about. The pivot points are provided integrally with the rigid portion of the clamping portion so that the fingers can flex independently of each other. The member is made from a single piece of machined steel.

REFERENCES:
patent: 5035034 (1991-07-01), Cotney
patent: 6062459 (2000-05-01), Sabyeying
patent: 6478211 (2002-11-01), Ball et al.

Affiliated with

Also associated with

Rating

Lead frame wire bonding clamp member does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame wire bonding clamp member, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame wire bonding clamp member will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3440848