Lead frame without power buses for lead on chip package, and a s

Details Lead frame without power buses for lead on chip package, and a s Lead frame without power buses for lead on chip package, and a s

1993-04-28

1994-06-07

Wojciechowicz, Edward

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257670, 257750, 257758, 257773, 257783, H01L 2332

Patent

active

053192419

ABSTRACT:
A conductive tape for a packaged semiconductor device is disclosed. The tape contains a first adhesive layer, a base film on top of the first adhesive layer, a conductive layer on top of the base film layer, and a second adhesive layer on top of the conductive layer. Metal may form the conductive layer. The tape may have slits, slots, or apertures in it so that electrical connection may be made to the conductive layer. Such a tape is useful in lead on chip integrated circuit packages to connect the semiconductor die to the lead frame and to function as a power supply bus by transferring power to the semiconductor die. Wire bonds extending through slots in the second adhesive layer form electrical connection from the lead fingers for receiving power to the conductive layer of the tape. Wire bonds extending from the bonding pads of the semiconductor die through slots the second adhesive layer form electrical connection from the semiconductor die to the conductive layer.

REFERENCES:
patent: 5089876 (1992-02-01), Ishioka

Affiliated with

Also associated with

Rating

Lead frame without power buses for lead on chip package, and a s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame without power buses for lead on chip package, and a s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame without power buses for lead on chip package, and a s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-794961