Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-03-14
2006-03-14
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S670000, C257S669000, C257S674000
Reexamination Certificate
active
07012324
ABSTRACT:
A lead frame (201) for a packaged electronic device having split flag structures (205, 207) coupled by support structures (219). The support structures include bend portions (233) for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device (301). In one embodiment, the packaged electronic device includes an inertial sensor (515).
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Chapman Michael E. S.
Li Gary G.
Mahadevan Dave S.
Dolezal David G.
Freescale Semiconductor Inc.
Nguyen Dilinh
Pham Hoai
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