Lead frame with strip-shaped die bonding pad

Details Lead frame with strip-shaped die bonding pad Lead frame with strip-shaped die bonding pad

1998-02-09

2000-02-22

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257676, 257666, H01L 23495

Patent

active

060283505

ABSTRACT:
A lead frame, comprises a pair of spaced apart rail portions and a plurality of leads therebetween for attachment to a semiconductor die and defining an area for accommodating a semiconductor device. A single, narrow, strip shaped tie bar of substantially constant width extends between and substantially perpendicular to the rail portions and traverses a narrow portion of the die receiving area. A die pad portion is provided for bonding to the die intermediate the ends of the strip.

REFERENCES:
patent: 5162895 (1992-11-01), Takahashi et al.
patent: 5521428 (1996-05-01), Hollingsworth et al.
patent: 5714792 (1998-02-01), Przano
patent: 5796162 (1998-08-01), Huang

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