Lead frame with deformable buffer portions

Details Lead frame with deformable buffer portions Lead frame with deformable buffer portions

1993-04-23

1994-08-16

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, H01L 2348, H01L 2946, H01L 2962, H01L 2964

Patent

active

053389727

ABSTRACT:
A lead frame has a central portion and groups of lead terminals distributed around the four peripheral sides of the central portion, along with main buffer portions coupling the lead terminals together in corresponding groups to prevent warping of the lead frame as a result of contraction of an injection-molded resin body during hardening. In addition, slits are provided outside the buffer portions which extend farther at one end of the slits than the corresponding side of the resin body, and auxiliary buffer portions located at both ends of the slits support the main buffer portions.

REFERENCES:
patent: 4870474 (1989-09-01), Karashima
patent: 5223738 (1993-06-01), Okada

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