Lead frame with pre-mold paddle for a semiconductor chip package

Details Lead frame with pre-mold paddle for a semiconductor chip package Lead frame with pre-mold paddle for a semiconductor chip package

1997-12-23

2000-07-18

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257788, 257703, 257793, 257674, 257649, 257671, H05K 718, H01L 2350, H01L 23495

Patent

active

060911352

ABSTRACT:
An improved lead frame with a pre-mold paddle for a semiconductor chip package which prevents delamination and cracking between a mold body and the pre-mold paddle on which a semiconductor chip in the semiconductor chip package is placed.

REFERENCES:
patent: 4400714 (1983-08-01), Brown
patent: 4466183 (1984-08-01), Burns
patent: 4536825 (1985-08-01), van Dyk Soerewyn
patent: 4651415 (1987-03-01), Frampton
patent: 4763409 (1988-08-01), Takekawa et al.
patent: 5214846 (1993-06-01), Asami et al.
patent: 5233222 (1993-08-01), Djennas et al.
patent: 5275897 (1994-01-01), Nagesh et al.
patent: 5278447 (1994-01-01), Vongfuangfoo et al.
patent: 5299097 (1994-03-01), Kondo et al.
patent: 5521428 (1996-05-01), Hollingsworth et al.
patent: 5539251 (1996-07-01), Iverson et al.
patent: 5661338 (1997-08-01), Yoo et al.
T. Cho, et al.; "An Improvement in Reflow Performance of Plastic Packages"; 46th Electronic Components & Technology Conference; May 1996; pp. 931-935.
N. Bhandarkar, et al. "Low-Stress Leadframe Design for Plastic IC Packages"; 46th Electronic Components & Technology Conference; May 1996; pp. 803-807.

Affiliated with

Also associated with

Rating

Lead frame with pre-mold paddle for a semiconductor chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame with pre-mold paddle for a semiconductor chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame with pre-mold paddle for a semiconductor chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2039522