LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Dambarless leadframe for molded component encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Data carrier with a module with a reinforcement strip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Data carrier with a module with a reinforcement strip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Deformable leadframe for overcurrent protection

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Deformation-absorbing leadframe for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Design of device layout for integration with power mosfet packag

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Device and method for hermetically sealing a cavity in an...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension

Device assembly structure with reinforced outer leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Device for attaching a semiconductor chip to a chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Device for packing electronic components using injection...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Device packaging using tape automated bonding (TAB) strip...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Die assemblies using suspended bond wires, carrier substrates an

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Die attach method and leadframe structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die attach pad for use in semiconductor manufacturing and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die attach paddle for mounting integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die attach paddle for mounting integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die attach paddle for mounting integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die attach region for use in a micro-array integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die package