Die attach paddle for mounting integrated circuit die

Details Die attach paddle for mounting integrated circuit die Die attach paddle for mounting integrated circuit die

2007-11-16

2009-12-29

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257SE23031

Reexamination Certificate

active

07638862

ABSTRACT:
An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surface and a lower surface, with the upper surface configured to electrically couple a first end of a first electrically conductive lead wire. A second end of the first electrically conductive lead wire is bonded to the integrated circuit die. The upper surface is further configured to electrically couple a first end of a second electrically conductive lead wire and a second end of the second electrically conductive lead wire is bonded to a lead finger of the electrical package.

REFERENCES:
patent: 4771330 (1988-09-01), Long
patent: 4942455 (1990-07-01), Shinohara
patent: 5157480 (1992-10-01), McShane et al.
patent: 5168368 (1992-12-01), Gow, 3rd et al.
patent: 5196992 (1993-03-01), Sawaya
patent: 5399904 (1995-03-01), Kozono
patent: 5512781 (1996-04-01), Inoue
patent: 5804468 (1998-09-01), Tsuji et al.
patent: 6313519 (2001-11-01), Gainey et al.
patent: 6388311 (2002-05-01), Nakashima et al.
patent: 6577019 (2003-06-01), Roberts et al.
patent: 6603195 (2003-08-01), Caletka et al.
patent: 6713852 (2004-03-01), Abbott et al.
patent: 6818973 (2004-11-01), Foster
patent: 6908843 (2005-06-01), Baldonado et al.
patent: 6998702 (2006-02-01), Zwenger et al.
patent: 7323765 (2008-01-01), Lam
patent: 2002/0149099 (2002-10-01), Shirasaka et al.
patent: 2003/0015780 (2003-01-01), Kang et al.
patent: 2003/0205795 (2003-11-01), Roberts et al.
patent: 2008/0064145 (2008-03-01), Lam
patent: WO 06044061 (2006-04-01), None
“U.S. Appl. No. 11/941,234 Non-Final Office Action mailed Apr. 30, 2008”, 6 pgs.
“U.S. Appl. No. 11/941,234 Notice of Allowance mailed Jan. 12, 2009”, 6 pgs.
“U.S.Appl. No. 11/941,234 Response filed Sep. 17, 2008 to Non-Final Office Action mailed Jun. 19, 2008”, 12 pgs.
“International Application Serial No. PCT/US05/32386 Search Report mailed Jul. 1, 2008”, 4 pages.
“International Application Serial No. PCT/US05/32386 Written Opinion mailed Jul. 01, 2008”, 5 pages.
“Production Leadframes”, Printout: Simtek Corporation, (Sep. 2002), 6 pgs.
“U.S. Appl. No. 11/941,234 Non-Final Office Action mailed 06/19/08”, 6 pgs.

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