Die assemblies using suspended bond wires, carrier substrates an

Details Die assemblies using suspended bond wires, carrier substrates an Die assemblies using suspended bond wires, carrier substrates an

1996-11-04

1998-12-08

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257666, 257668, 257674, 257698, 257786, H01L 2328, H01L 2312

Patent

active

058474455

ABSTRACT:
A rail of non-conductive material is applied to a semiconductor die and/or to the carrier substrate to which it is or will be bonded. The rail underlies those wires joining the die bond pads and substrate traces, which wires have an inordinate length, i.e. greater than about 100 mils for 1.0 mil diameter wires, to prevent sagging wires from contacting the die edge and breaking, or shorting to active areas on the die or substrate. A pattern of rails may be formed on the dice of an undivided wafer by, for example, screen printing. Rails may also be formed on the substrate, and rails on the substrate employed in combination with rails on dice carried thereon.

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