Device and method for hermetically sealing a cavity in an...

Details Device and method for hermetically sealing a cavity in an... Device and method for hermetically sealing a cavity in an...

2005-12-13

2010-10-19

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S677000, C257SE23041, C257SE23193, C257S729000, C257S789000

Reexamination Certificate

active

07816770

ABSTRACT:
To hermetically seal a cavity in a microelectronic component, a cap located in a sealing device is positioned above the orifice opening into the cavity. The cap plastically deforms to seal the cavity. The sealing device includes a cavity permitting the cavity of the microelectronic component to be filled. The sealing device slides along the component so as to be positioned opposite either the filling cavity, or the cap.

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patent: 2007/0218585 (2007-09-01), Robert
patent: 2002-190548 (2002-07-01), None
Shung-Wen Kang, et al., “Fabrication and Test of Radial Grooved Micro Heat Pipes”, Applied Thermal Engineering, vol. 22, 2002, pp. 1559-1568.

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