Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-04-22
2008-04-22
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S676000, C257S734000, C257S735000, C257S736000, C257S753000, C257SE23035, C428S209000
Reexamination Certificate
active
07361976
ABSTRACT:
In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47, 48) of a chip (41), are connected to a reinforcement film (66, 71) formed from a fiber-reinforced film of plastics material by means of a layer (73) of an adhesive that is particularly well suited to transmitting shear forces, in which case there is additionally provided in an advantageous further embodiment, on the reinforcement film (66, 71), at least one further layer (74, 75, 76) that is able to serve for protecting, damping or fastening purposes.
REFERENCES:
patent: 5005282 (1991-04-01), Rose
patent: 5703399 (1997-12-01), Majumdar et al.
patent: 7166914 (2007-01-01), DiStefano et al.
patent: 2007/0176287 (2007-08-01), Crowley et al.
patent: WO 00 72253 (2000-11-01), None
Akkahadsi Somnuk
Fritz Reinhard
Schmallegger Peter
Clark Jasmine
NXP B.V.
Zawilski Peter
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