Device packaging using tape automated bonding (TAB) strip...

Details Device packaging using tape automated bonding (TAB) strip... Device packaging using tape automated bonding (TAB) strip...

2006-02-28

2006-02-28

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S723000, C257S777000

Reexamination Certificate

active

07005729

ABSTRACT:
In one embodiment of the invention, a die is bonded on a strip carrier frame having a carrier alignment landmark. A tape automated bonding (TAB) strip having a TAB alignment landmark is aligned with the strip carrier frame. The TAB strip is bonded to the strip carrier frame to form a bonded unit.

REFERENCES:
patent: 5717252 (1998-02-01), Nakashima et al.
patent: 6362022 (2002-03-01), Hinkle et al.
patent: 6445077 (2002-09-01), Choi et al.
patent: 6552419 (2003-04-01), Toyosawa

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