Die attach paddle for mounting integrated circuit die

Details Die attach paddle for mounting integrated circuit die Die attach paddle for mounting integrated circuit die

2008-01-29

2008-01-29

Purvis, Sue A. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S782000, C257S784000, C257SE23003, C257SE23006, C257SE23020, C257SE23037, C257SE23043

Reexamination Certificate

active

07323765

ABSTRACT:
An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surface and a lower surface, with the upper surface configured to electrically couple a first end of a first electrically conductive lead wire. A second end of the first electrically conductive lead wire is bonded to the integrated circuit die. The upper surface is further configured to electrically couple a first end of a second electrically conductive lead wire and a second end of the second electrically conductive lead wire is bonded to a lead finger of the electrical package.

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Printout: Simtek Corporation, “Production Leadframes”, Sep. 2002, 6 pages.

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