Plastic package type semiconductor device having a rolled metal

Details Plastic package type semiconductor device having a rolled metal Plastic package type semiconductor device having a rolled metal

1992-07-01

1995-10-03

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257500, 257501, 257528, 257632, 257635, 257640, 257649, 257706, 257717, 257728, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054554535

ABSTRACT:
A plastic package type semiconductor device is composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element is mounted on the film or on the exposed surface of the substrate. Other passive elements are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding. This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.

REFERENCES:
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patent: 4151543 (1979-04-01), Hayakawa et al.
patent: 4172261 (1979-10-01), Tsuzuki et al.
patent: 4561010 (1985-12-01), Ogihara et al.
patent: 4639760 (1987-01-01), Granberg et al.
patent: 4686559 (1987-08-01), Haskell
patent: 4717681 (1988-01-01), Curran
patent: 4873559 (1989-10-01), Shimizu et al.
patent: 4947234 (1990-08-01), Einzinger et al.
patent: 5103283 (1992-04-01), Hite
patent: 5164339 (1992-11-01), Gimpelson

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