Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2006-05-02
2006-05-02
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C257S666000, C257S691000, C257S692000, C257S698000, C257S784000, C257S712000, C257S713000, C438S123000, C438S617000
Reexamination Certificate
active
07038305
ABSTRACT:
An integrated circuit device package and method of assembling same is disclosed. The device package includes an interposer ring substrate having a hollowed out center mounted on a die attach pad, a die mounted substantially in the center of the die attach pad such that the die is encompassed by the hollowed out center. The package further includes a single-piece drop-in heat sink having a first and second disk shaped portions where the first disk shaped portion has a diameter that is different than the second disk shaped portion.
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Chet Tan Ping
Leng Allen Cheah Chong
Altera Corp.
Parekh Nitin
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