Plastic molded semiconductor package

Details Plastic molded semiconductor package Plastic molded semiconductor package

1997-06-27

1999-08-10

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257691, 257707, H01L 23495, H01L 2352, H01L 2310

Patent

active

059363037

ABSTRACT:
In construction of a plastic molded semiconductor package including a semiconductor die arranged on a heat sink and provided with earth and power source terminal pads and earth and power source leads arranged on the heat sink via an insulating sheet whilst surrounding the semiconductor die, concentric earth and power source conductive galleries are arranged on the insulating sheet around the semiconductor die as an interface between the terminal pads on the semiconductor die and the leads. The earth gallery connects the earth terminal pads to the earth leads whereas the power source gallery connects the power source pads to the power source leads. Use of the interface galleries reduces mutual inductance between the leads greatly, makes the entire construction very compact and significantly lowers the production cost.

REFERENCES:
patent: 4891687 (1990-01-01), Mallik et al.
patent: 5723899 (1998-03-01), Shin
patent: 5757070 (1998-05-01), Fritz

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