Package for receiving electronic parts, and electronic...

Details Package for receiving electronic parts, and electronic... Package for receiving electronic parts, and electronic...

2006-03-17

2010-06-29

Trinh, Hoa B (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S706000, C257S712000, C257S796000, C257SE33075

Reexamination Certificate

active

07745914

ABSTRACT:
A package for receiving electronic part has a heat radiating plate having a mounting area where the electronic part is mounted at a center portion of one main surface, a frame body adhered to the one main surface to surround the mounting area, and a wiring conductor derived from the inside to the outside of the frame body. The heat radiating plate has a metallic base body, a metallic body filling inside of the metallic base body, and a metal layer deposited on the metallic base body and the metallic body. The mounting area is formed on the metal layer so as to be located above the metallic body, both of the metallic body and the metal layer have higher thermal conductivity than the metallic body, and both of the frame body and the metallic base body have a smaller coefficient of thermal expansion than the metal layer.

REFERENCES:
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5367196 (1994-11-01), Mahulikar et al.
patent: 5959356 (1999-09-01), Oh
patent: 6921971 (2005-07-01), Basho et al.
patent: 2006/0172465 (2006-08-01), Brennan et al.
patent: 04-348062 (1992-03-01), None
patent: 6-334074 (1994-12-01), None
patent: 9-45828 (1997-02-01), None

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