LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame,With bumps on ends of lead fingers to connect to semiconductor

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Chip carrier semiconductor device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Patent

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Chip package structure and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Chip scale package having flip chip interconnect on die paddle

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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COF-use tape carrier and COF-structured semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Compact power semiconductor package and method with stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Copper interconnect for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Device for attaching a semiconductor chip to a chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Die attach method and leadframe structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Drop resistant bumpers for fully molded memory cards

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Electrically isolated and thermally conductive double-sided...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Electronic device with plural pad connection of semiconductor ch

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Patent

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Electronic package for image sensor, and the packaging...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Flexible substrate for package of die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Flip chip mounted semiconductor device package having a...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Flip-chip semiconductor package with lead frame as chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Flip-chip type quad flat package and leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Gravitationally assisted control of spread of viscous...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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Integrated circuit package and process for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Reexamination Certificate

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