Integrated circuit package and process for fabricating the same

Details Integrated circuit package and process for fabricating the same Integrated circuit package and process for fabricating the same

2006-08-15

2006-08-15

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S737000, C257S738000, C257SE23021, C257SE23069, C438S121000, C438S123000, C438S124000

Reexamination Certificate

active

07091581

ABSTRACT:
A process for fabricating an integrated circuit package includes: selectively etching a leadframe strip to define a die attach pad and at least one row of contact pads; mounting a semiconductor die to one side of the leadframe strip, on the die attach pad; wire bonding the semiconductor die to ones of the contact pads; releasably clamping the leadframe strip in a mold by releasably clamping the contact pads; molding in a molding compound to cover the semiconductor die, the wire bonds and a portion of the contact pads not covered by the clamping; releasing the leadframe strip from the mold; depositing a plurality of external contacts on the one side of the leadframe strip, on the contact pads, such that the external contacts protrude from the molding compound; and singulating to provide the integrated circuit package.

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