Electronic device with plural pad connection of semiconductor ch

Details Electronic device with plural pad connection of semiconductor ch Electronic device with plural pad connection of semiconductor ch

1993-03-08

1995-08-01

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

257737, 257787, 257790, 361767, 361808, 174 524, H01L 2348, H01L 2944

Patent

active

054382220

ABSTRACT:
A miniaturized electronic device and a manufacturing method for the same is disclosed. Solder is provided on pads provided on leads and corresponding pads provided on an electronic part chip of the electronic device are placed on the solder. The solder is radiated with infrared rays and thereby melted. Then connecting parts are completed. This electronic device does not have a die and wires for bonding. Therefore, it is more miniaturized than a conventional electronic device.

REFERENCES:
patent: 3868724 (1975-02-01), Perrino
patent: 4001872 (1977-01-01), Khajezadeh
patent: 4024570 (1977-05-01), Hartmann et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4814295 (1989-03-01), Mehta
patent: 4912545 (1990-03-01), Go
patent: 4974057 (1990-11-01), Tazima
patent: 5057900 (1991-10-01), Yamazaki

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