LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Aluminum/ceramic bonding substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling

Anchor for device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Angled edge connections for multichip structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Angled edge connections for multichip structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Angularly offset and recessed stacked die multichip device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Angularly offset stacked die multichip device and method of manu

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Anisotropic stress buffer and semiconductor device using the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Antenna-incorporated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Anti tamper encapsulation for an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Anti-tamper bond wire shield for an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Anti-tamper integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Aperture formation in aluminum circuit card for enhanced thermal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Apparatus and method for an integrated circuit having high Q...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Apparatus and method for flat circuit assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Apparatus and method for forming heat sinks on silicon on...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Apparatus and method for hermetically sealing and EMI...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Apparatus and method for housing micromechanical systems

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Apparatus and method for leadless packaging of semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Apparatus and method for leadless packaging of semiconductor...