Apparatus and method for housing micromechanical systems

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

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Details

C257S680000, C257S698000, C257S729000, C257SE23001, C257SE23018, C257SE21007

Reexamination Certificate

active

07898071

ABSTRACT:
An apparatus for housing a micromechanical system includes a substrate with a surface on which the micromechanical system is formed, a transparent cover and a dry film layer arrangement between the surface of the substrate and the transparent cover. The dry film layer arrangement has an opening, so that the micromechanical system adjoins the opening.

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English language translation of an Official Communication issued in corresponding Chinese Patent Application No. 200810002282.3, mailed on Jun. 9, 2010.

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