Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate
2011-03-01
2011-03-01
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
C257S680000, C257S698000, C257S729000, C257SE23001, C257SE23018, C257SE21007
Reexamination Certificate
active
07898071
ABSTRACT:
An apparatus for housing a micromechanical system includes a substrate with a surface on which the micromechanical system is formed, a transparent cover and a dry film layer arrangement between the surface of the substrate and the transparent cover. The dry film layer arrangement has an opening, so that the micromechanical system adjoins the opening.
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English language translation of an Official Communication issued in corresponding Chinese Patent Application No. 200810002282.3, mailed on Jun. 9, 2010.
Bakke Thor
Sandner Thilo
Clark Jasmine J
Faunhofer-Gesellschaft zur Foerderung der angewandten Forschung
Keating & Bennett LLP
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