Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent
1997-02-24
1999-01-19
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
257784, 257786, 257774, 380 24, 380 25, 380 30, 380 4, G06K 500, G06K 900, H04K 100
Patent
active
058616624
ABSTRACT:
An anti-tamper shield for an integrated circuit (IC) includes a bond wire which passes through a protective layer such as an epoxy encapsulating layer of the IC. The bond wire carries a signal, such as a steady state current, which allows an active component of the IC, such as a secure processor, to function. The bond wire is carried within and/or proximate to the encapsulating layer such that a decapsulation of the IC will cause a rupture of the electrically conductive member, thereby rendering the processor non-functional. The bond wire may be coupled to the processor in a variety of configurations, including the use of internal or external bond pads, lead frame contacts, and/or directly to a computer board on which the IC is carried. A metallic shield layer may be located between the active component and a top portion of the encapsulating layer to prevent a pirate from using an electron microscope, for example, to survey the active component region.
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General Instrument Corporation
Hoppin Ralph F.
Lipsitz Barry R.
Thomas Tom
Williams Alexander Oscar
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