Angularly offset stacked die multichip device and method of manu

Details Angularly offset stacked die multichip device and method of manu Angularly offset stacked die multichip device and method of manu

1995-08-16

1998-02-24

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257686, 257723, 257777, H01L 2302

Patent

active

057214522

ABSTRACT:
An offset die stacking arrangement is disclosed having at least one upper level die having a width which is less than the distance separating the opposing bonding sites of the underlying die. The upper die is suspended above the lower die on one or more pillars and rotated within a plane parallel to the lower die through an angle which insures that none of the bonding sites of the lower die are obstructed by the upper die. Once the dice are fixed in this manner, the entire assembly is subjected to the wire bonding process with all of the bonds being made in the same step.

REFERENCES:
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.

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