LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Preserving clearance between encapsulant and PCB for cavity-down

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Press-connection semiconductor device and press-connection...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Press-contact type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Press-contact type semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Press-fit chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Press-fit diode for universal mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Press-fit IC power package and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Press-fit semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Pressure contact type semiconductor device and heat compensator

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Pressure contact type semiconductor device with ringshaped...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Pressure-bonded heat-sink system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Pressure-contact semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Pressure-contact type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Pressure-contact type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Preventing access to stub traces on an integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Preventing backside analysis of an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Prevention of contamination on bonding pads of wafer during SMT

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Prevention of post CMP defects in CU/FSG process

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Printed board and semiconductor integrated circuit