Pressure contact type semiconductor device and heat compensator

Details Pressure contact type semiconductor device and heat compensator Pressure contact type semiconductor device and heat compensator

1993-06-18

1996-02-06

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With large area flexible electrodes in press contact with...

257689, 257712, 257713, 257718, 257719, 361707, 361714, H01L 2302, H02B 104

Patent

active

054898021

ABSTRACT:
A semiconductor substrate (2) is pressed against heat compensators (6, 31) for electrical contact therewith without brazing. Silicone rubber (32) fixes the outer peripheral edge of the semiconductor substrate (2) and its adjacent portion on the heat compensator (31), preventing position shifts of the semiconductor substrate (2) without thermal distortion and, accordingly, preventing damages to the semiconductor substrate (2). The absence of thermal distortion, spikes, voids due to brazing permits the prevention of electrical characteristic deterioration.

REFERENCES:
patent: 3992717 (1976-11-01), Rice
patent: 5047836 (1991-09-01), Tokunoh
patent: 5117281 (1992-05-01), Katsuraka
Patent Abstracts of Japan, vol. 13, No. 413, E-820, Sep. 12, 1989, JP 1-152668, Jun. 15, 1989.
Patent Abstracts of Japan, vol. 14, No. 401, E-971, Aug. 30, 1990, JP 2-151069, Jun. 11, 1990.

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