Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-11-30
2011-10-25
Luu, Chuong A. (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S702000, C257S635000, C257S642000
Reexamination Certificate
active
08044505
ABSTRACT:
A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided. The prepreg according to the present invention includes a core layer including a sheet-shaped base member and having one surface and the other surface which is opposite to the one surface, the first resin layer provided on the one surface of the core layer and formed of a first resin composition, and the second resin layer provided on the other surface of the core layer and formed of a second resin composition, wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied.
REFERENCES:
patent: 6866919 (2005-03-01), Ikeguchi et al.
patent: 2003/0162006 (2003-08-01), Ikeguchi et al.
patent: 2003-340952 (2003-12-01), None
patent: 228454 (2005-03-01), None
patent: 2005/092945 (2005-10-01), None
Chinese Office Action for Application No. 200680045072.1 issued on Sep. 3, 2010.
Baba Takayuki
Hamaya Kazuya
Hosomi Takeshi
Yuasa Maroshi
Luu Chuong A.
Smith , Gambrell & Russell, LLP
Sumitomo Bakelite Company Limited
LandOfFree
Prepreg, method for manufacturing prepreg, substrate, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Prepreg, method for manufacturing prepreg, substrate, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Prepreg, method for manufacturing prepreg, substrate, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4296022